Live search
TopFind is fetching the latest matches for your search.
We reviewed 57 live results for wafer thinning and narrowed them down to the 3 options that look most worth comparing first.
The strongest themes across this short list are Semiconductor Services and Wafer Thinning.
Source: Sony Device Technology (Thailand) Co., Ltd.
Description
Production-scale assembly services for image sensors and LSIs, including critical wafer backgrinding and thinning for automotive and mobile applications.
Best for
image sensor fabrication, automotive electronics, mobile sensors and high-reliability assembly
Rating
Source: Hana Microelectronics
Description
Precision wafer backgrinding and thinning services for 8-inch and 12-inch wafers. The facility utilizes non-contact thickness measurement to ensure high quality and precision for semiconductor manufacturing.
Best for
semiconductor manufacturing, 8-inch wafer processing, 12-inch wafer processing and high-volume OSAT needs
Rating
Source: Hana Microelectronics Public Co., Ltd.
Description
Comprehensive wafer-level processing including 12-inch wafer capability, wafer test and sorting, backgrinding, and precision dicing. These backend semiconductor services ensure high-yield preparation for subsequent assembly stages.
Best for
wafer fabrication clients, 12-inch wafer processing and die preparation
Rating
| Compare | Semiconductor Assembly and Thinning | Wafer Backgrind and Wafer Sort/Dicing | Wafer Services |
|---|---|---|---|
| Source | Sony Device Technology (Thailand) Co., Ltd. | Hana Microelectronics | Hana Microelectronics Public Co., Ltd. |
| Description | Production-scale assembly services for image sensors and LSIs, including critical wafer backgrinding and thinning for automotive and mobile applications. | Precision wafer backgrinding and thinning services for 8-inch and 12-inch wafers. The facility utilizes non-contact thickness measurement to ensure high quality and precision for semiconductor manufacturing. | Comprehensive wafer-level processing including 12-inch wafer capability, wafer test and sorting, backgrinding, and precision dicing. These backend semiconductor services ensure high-yield preparation for subsequent assembly stages. |
| Best for | image sensor fabrication, automotive electronics, mobile sensors and high-reliability assembly | semiconductor manufacturing, 8-inch wafer processing, 12-inch wafer processing and high-volume OSAT needs | wafer fabrication clients, 12-inch wafer processing and die preparation |
| Tags | |||
| Action | View Details | View Details | View Details |
| Rating |
If you want the most balanced option to start with, I recommend:
"Semiconductor Assembly and Thinning from Sony Device Technology (Thailand) Co., Ltd.."
I picked this because Leverages Sony's global technology standards for high-performance sensor assembly and precise wafer thinning.