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सोच रहा है
सोच रहा है
हमने wafer singulation के लिए 97 लाइव परिणाम देखे और पहले तुलना करने लायक 3 विकल्प चुने।
विकल्प हैं Wafer Singulation, Wafer Backgrind and Wafer Sort/Dicing, और Wafer Services.
स्रोत: Stars Microelectronics (Thailand) PCL
विवरण
High-precision wafer dicing services utilizing advanced techniques such as stealth dicing, laser ablation, and traditional blade dicing to maximize die yield and minimize damage.
सबसे उपयुक्त
Thin wafer dicing, High Yield requirements और Fragile wafer materials
रेटिंग
स्रोत: Hana Microelectronics
विवरण
Precision wafer backgrinding and thinning services for 8-inch and 12-inch wafers. The facility utilizes non-contact thickness measurement to ensure high quality and precision for semiconductor manufacturing.
सबसे उपयुक्त
Semiconductor manufacturing, 8 Inch wafer processing, 12 Inch wafer processing और High Volume OSAT needs
रेटिंग
स्रोत: Hana Microelectronics Public Co., Ltd.
विवरण
Comprehensive wafer-level processing including 12-inch wafer capability, wafer test and sorting, backgrinding, and precision dicing. These backend semiconductor services ensure high-yield preparation for subsequent assembly stages.
सबसे उपयुक्त
Wafer fabrication clients, 12 Inch wafer processing और Die preparation
रेटिंग
| तुलना करें | #1Wafer Singulation | #2Wafer Backgrind and Wafer Sort/Dicing | #3Wafer Services |
|---|---|---|---|
| स्रोत | Stars Microelectronics (Thailand) PCL | Hana Microelectronics | Hana Microelectronics Public Co., Ltd. |
| विवरण | High-precision wafer dicing services utilizing advanced techniques such as stealth dicing, laser ablation, and traditional blade dicing to maximize die yield and minimize damage. | Precision wafer backgrinding and thinning services for 8-inch and 12-inch wafers. The facility utilizes non-contact thickness measurement to ensure high quality and precision for semiconductor manufacturing. | Comprehensive wafer-level processing including 12-inch wafer capability, wafer test and sorting, backgrinding, and precision dicing. These backend semiconductor services ensure high-yield preparation for subsequent assembly stages. |
| सबसे उपयुक्त | Thin wafer dicing, High Yield requirements और Fragile wafer materials | Semiconductor manufacturing, 8 Inch wafer processing, 12 Inch wafer processing और High Volume OSAT needs | Wafer fabrication clients, 12 Inch wafer processing और Die preparation |
| कार्रवाई | Wafer Singulation | Wafer Backgrind and Wafer Sort/Dicing | Wafer Services |
| रेटिंग |
"Wafer Singulation से Stars Microelectronics (Thailand) PCL."
मैंने इसे इसलिए चुना क्योंकि Offers cutting-edge stealth dicing and laser ablation for thin wafers and sensitive materials.
नोट: TopFind केवल सामान्य शोध उद्देश्यों के लिए तुलना जानकारी प्रदान करता है।