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We reviewed 2 live results for deballing and narrowed them down to the 2 options that look most worth comparing first.
The options are BGA Reballing Services and BGA Reballing Services.
Source: Solder.net
Description
BEST Inc. provides comprehensive BGA reballing services to restore ball grid array components to original specifications or convert solder alloys including Sn63Pb37, SAC305, and Sn90Pb10. Accommodating package sizes from 3x3mm to 60x60mm with ball counts exceeding 8,000, the service supports low-volume custom rework via proprietary EZReball preforms as well as high-volume automated pick-and-place ball attach with optical and X-ray inspection.
Best for
Electronics manufacturers, Medical device OEMs, Replacing discontinued alloy solder balls on BGA components and Salvaging or restoring high-pin-count BGA packages
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Source: Molex ISI Microelectronics and Advanced Packaging Solutions
Description
BGA Reballing Services from Molex ISI Microelectronics and Advanced Packaging Solutions provide audited and qualified ball grid array reballing for military, aerospace, and high-reliability applications. The 10-step certified process replaces lead-free solder spheres with leaded Sn63Pb37 eutectic spheres or custom alloys across any package and pitch. It features custom nitrogen reflow profiles, automated optical inspection for coplanarity and flatness, ionograph cleanliness verification, and expedited 3 to 5 day turnaround options.
Best for
defense contractors, aerospace manufacturers, converting lead-free components to leaded eutectic solder and military and hi-rel electronics packaging
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| Compare | #1BGA Reballing Services | #2BGA Reballing Services |
|---|---|---|
| Source | Solder.net | Molex ISI Microelectronics and Advanced Packaging Solutions |
| Description | BEST Inc. provides comprehensive BGA reballing services to restore ball grid array components to original specifications or convert solder alloys including Sn63Pb37, SAC305, and Sn90Pb10. Accommodating package sizes from 3x3mm to 60x60mm with ball counts exceeding 8,000, the service supports low-volume custom rework via proprietary EZReball preforms as well as high-volume automated pick-and-place ball attach with optical and X-ray inspection. | BGA Reballing Services from Molex ISI Microelectronics and Advanced Packaging Solutions provide audited and qualified ball grid array reballing for military, aerospace, and high-reliability applications. The 10-step certified process replaces lead-free solder spheres with leaded Sn63Pb37 eutectic spheres or custom alloys across any package and pitch. It features custom nitrogen reflow profiles, automated optical inspection for coplanarity and flatness, ionograph cleanliness verification, and expedited 3 to 5 day turnaround options. |
| Best for | Electronics manufacturers, Medical device OEMs, Replacing discontinued alloy solder balls on BGA components and Salvaging or restoring high-pin-count BGA packages | defense contractors, aerospace manufacturers, converting lead-free components to leaded eutectic solder and military and hi-rel electronics packaging |
| Action | Solder.net | Molex ISI Microelectronics and Advanced Packaging Solutions |
| Rate this product |
"BGA Reballing Services from Solder.net."
Note: TopFind AI compiles product and service information for general comparison purposes only.