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We reviewed 3 live results for bga返修台 and narrowed them down to the 3 options that look most worth comparing first.
The options are BGA Rework, Martin MaFi IXH BGA 返修台 and BGA Reballing Services.
Source: Suntronic Inc.
Description
Suntronic Inc. provides professional BGA rework and consulting services in the United States, utilizing facilities across Houston, Austin, and Dallas. Their specialized circuit board repair capabilities include pad and track repair, solder mask restoration, BGA site modification with jumper wires, bonded replacement of damaged or missing pads, and complex component removal and replacement for packages featuring over 1,000 balls at 1.0mm pitch. Testing protocols include X-ray inspection, automated optical inspection, and functional testing.
Best for
Electronics manufacturers, PCB designers, Repairing damaged PCB pads and solder masks and Replacing complex BGA components
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Source: 欣岩企業有限公司
Description
Martin MaFi IXH 為德國製造的專業 BGA 返修台，適用於 300x240mm 以內的電路板作業。設備具備零件返修定位輔助影像識別系統、平板電腦主機控制套件、Easy Solder 07 作業程式軟體，並搭載 2000 瓦紅外線與熱風底部加熱器及非接觸式熱風除錫裝置，提供 BGA 零件拆取、除錫、植球、放置與迴焊等完整返修功能。
Best for
電子維修工程師, SMT產線工程師, 電路板BGA零件返修 and BGA拆焊與植球作業
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Source: Solder.net
Description
BEST Inc. provides comprehensive BGA reballing services to restore ball grid array components to original specifications or convert solder alloys including Sn63Pb37, SAC305, and Sn90Pb10. Accommodating package sizes from 3x3mm to 60x60mm with ball counts exceeding 8,000, the service supports low-volume custom rework via proprietary EZReball preforms as well as high-volume automated pick-and-place ball attach with optical and X-ray inspection.
Best for
Electronics manufacturers, Medical device OEMs, Replacing discontinued alloy solder balls on BGA components and Salvaging or restoring high-pin-count BGA packages
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| Compare | #1BGA Rework | #2Martin MaFi IXH BGA 返修台 | #3BGA Reballing Services |
|---|---|---|---|
| Source | Suntronic Inc. | 欣岩企業有限公司 | Solder.net |
| Description | Suntronic Inc. provides professional BGA rework and consulting services in the United States, utilizing facilities across Houston, Austin, and Dallas. Their specialized circuit board repair capabilities include pad and track repair, solder mask restoration, BGA site modification with jumper wires, bonded replacement of damaged or missing pads, and complex component removal and replacement for packages featuring over 1,000 balls at 1.0mm pitch. Testing protocols include X-ray inspection, automated optical inspection, and functional testing. | Martin MaFi IXH 為德國製造的專業 BGA 返修台，適用於 300x240mm 以內的電路板作業。設備具備零件返修定位輔助影像識別系統、平板電腦主機控制套件、Easy Solder 07 作業程式軟體，並搭載 2000 瓦紅外線與熱風底部加熱器及非接觸式熱風除錫裝置，提供 BGA 零件拆取、除錫、植球、放置與迴焊等完整返修功能。 | BEST Inc. provides comprehensive BGA reballing services to restore ball grid array components to original specifications or convert solder alloys including Sn63Pb37, SAC305, and Sn90Pb10. Accommodating package sizes from 3x3mm to 60x60mm with ball counts exceeding 8,000, the service supports low-volume custom rework via proprietary EZReball preforms as well as high-volume automated pick-and-place ball attach with optical and X-ray inspection. |
| Best for | Electronics manufacturers, PCB designers, Repairing damaged PCB pads and solder masks and Replacing complex BGA components | 電子維修工程師, SMT產線工程師, 電路板BGA零件返修 and BGA拆焊與植球作業 | Electronics manufacturers, Medical device OEMs, Replacing discontinued alloy solder balls on BGA components and Salvaging or restoring high-pin-count BGA packages |
| Action | Suntronic Inc. | 欣岩企業有限公司 | Solder.net |
| Rate this product |
"BGA Rework from Suntronic Inc.."
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