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We reviewed 97 live results for wafer singulation and narrowed them down to the 3 options that look most worth comparing first.
The options are Wafer Singulation, Wafer Backgrind and Wafer Sort/Dicing, and Wafer Services.
Source: Stars Microelectronics (Thailand) PCL
Description
High-precision wafer dicing services utilizing advanced techniques such as stealth dicing, laser ablation, and traditional blade dicing to maximize die yield and minimize damage.
Best for
Thin wafer dicing, High Yield requirements and Fragile wafer materials
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Source: Hana Microelectronics
Description
Precision wafer backgrinding and thinning services for 8-inch and 12-inch wafers. The facility utilizes non-contact thickness measurement to ensure high quality and precision for semiconductor manufacturing.
Best for
Semiconductor manufacturing, 8 Inch wafer processing, 12 Inch wafer processing and High Volume OSAT needs
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Source: Hana Microelectronics Public Co., Ltd.
Description
Comprehensive wafer-level processing including 12-inch wafer capability, wafer test and sorting, backgrinding, and precision dicing. These backend semiconductor services ensure high-yield preparation for subsequent assembly stages.
Best for
Wafer fabrication clients, 12 Inch wafer processing and Die preparation
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| Compare | #1Wafer Singulation | #2Wafer Backgrind and Wafer Sort/Dicing | #3Wafer Services |
|---|---|---|---|
| Source | Stars Microelectronics (Thailand) PCL | Hana Microelectronics | Hana Microelectronics Public Co., Ltd. |
| Description | High-precision wafer dicing services utilizing advanced techniques such as stealth dicing, laser ablation, and traditional blade dicing to maximize die yield and minimize damage. | Precision wafer backgrinding and thinning services for 8-inch and 12-inch wafers. The facility utilizes non-contact thickness measurement to ensure high quality and precision for semiconductor manufacturing. | Comprehensive wafer-level processing including 12-inch wafer capability, wafer test and sorting, backgrinding, and precision dicing. These backend semiconductor services ensure high-yield preparation for subsequent assembly stages. |
| Best for | Thin wafer dicing, High Yield requirements and Fragile wafer materials | Semiconductor manufacturing, 8 Inch wafer processing, 12 Inch wafer processing and High Volume OSAT needs | Wafer fabrication clients, 12 Inch wafer processing and Die preparation |
| Action | Wafer Singulation | Wafer Backgrind and Wafer Sort/Dicing | Wafer Services |
| Rate this product |
"Wafer Singulation from Stars Microelectronics (Thailand) PCL."
TopFind picked this because Offers cutting-edge stealth dicing and laser ablation for thin wafers and sensitive materials.
Note: TopFind provides comparison information for general research purposes only.