Beschreibung
Comprehensive electronic assembly solutions including Full Turnkey, partially consigned, and consigned assembly models. The service covers Surface Mount Technology (SMT), through-hole, and mixed technology assembly. Features include 3D X-ray inspection for BGA and leadless devices, flying probe testing, and integrated DFM/DFA analysis to ensure high manufacturing yields and reliability for prototype and production quantities.
Am besten für
Full turnkey solutions, BGA assembly with .35mm pitch, Prototype electronics assembly und Mixed technology boards